Heat Sink Compound 250gm

Heat Sink Compound 250gmThe Heat Sink Compound 250gm is a thermal paste designed to enhance heat transfer between a heat sink and a component, improving cooling efficiency. It is ideal for use in electronics, computers, and other high power devices. Key Features: Quantity: 250 grams High Thermal Conductivity: Efficiently transfers heat from components to heat sinks. Applications: Computers, power transistors, LED lighting, and other electronic devices.

Target Interfaces: SWD (STM32) and SWIM (STM8)

Output form digital switch output (0 and 1 high and low level)

Calibrate values are 24C room temperature

you can read and write to the SD card over the SPI interface

Distinguish between reflective and non-reflective surface

and fast heat-up performance

Using high-current relay

) Temperature Operating 0 °C to 40 °C Storage -30 °C to 60 °C Relative humidity Operating humidity Non-condensing (<10°C)

this display offers excellent readability in indoor and low-light conditions

Motor mounting side - Height 23 mm

Temperature Range: Operating: -20 ℃ ~ 85 ℃

Name Value Program Memory Type Flash Program Memory Size (KB) 7 CPU Speed (MIPS/DMIPS) 5 SRAM (B) 368 Data EEPROM/HEF (bytes) 256 Digital Communication Peripherals 1-UART